نظرة عامة على الشركة

Shenzhen Anzewei Technology Co., Ltd.

2YRSShenzhen Anzewei Technology Co., Ltd.

die Attach

Semiconductor products use high-lead containing solder for a die attach material in various devices

Chip cleaning and testing

We are responsible for the quality of each chip

Chip Packaging and Testing

High quality chip packaging and testing is our manufacturing attitude

Chip quality inspection factor

High quality factories are responsible for every customer

مصنع حجم	1,000-3,000 square meters
موقع المصنع	3 / F, Building 2, Building 215, Henan Xin Cun, Songyuanxia Community, Guanhu Street, Longhua District, Shenzhen City, Guangdong Province
لا. من خطوط الإنتاج	8
عقد تصنيع	OEM Service Offered, Design Service Offered, Buyer Label Offered
السنوي قيمة الانتاج	Above US$100 Million

Inspection area

This is the inspection area, which will be checked again after AOI inspection

Detection Process

This machine detects whether BGA has been soldered properly, and whether there are any defects such as false soldering or tin connection.

Aol detection instrument

This is a testing tool for detecting defective products after passing through the furnace

Chip module re inspection machine

Check if the product is qualified